1. Technology Status Silicon vapor-deposited films are micron-sized films formed by vacuum deposition of silicon monoxide. Since silicon monoxide is very unstable, it is easily oxidized into silicon dioxide, so it is often written as SiOx in the formula where the x value is between 1-2. In principle, the evaporation techniques that can be used for vacuum coating can be used to form silicon evaporation films, but different methods have different requirements for the composition of the evaporation source material, and the resulting film composition is also different. In addition to the usual resistance heating or high-frequency induction heating, the SiOx film can be deposited in a vacuum chamber, and the SiOx film can also be deposited by electron beam (EB) and low-temperature plasma (Plasma). PC Materials of New Jersey, USA, used low-temperature plasma to prepare SiOx films for barrier flexible packaging under the conditions of 40-50 ℃ and vacuum of 0.75mm Hg. At the same time, a research institute in California, USA, also used commercial plasma enhanced chemical vapor deposition (PECVD) equipment to manufacture SiOx films for food packaging. In Japan, it has been reported that argon ion sputtering technology is used to deposit SiOx film on PET material. The target source composition used is SiO2, 74%; CaO, 0%; NaO, 16%, almost the composition of ordinary soda lime glass. In addition to the deposition of SiOx films on plastic films, the research work on the plating of other inorganic materials with special properties has been launched. The research trends of these new materials deserve our close attention. Second, the structure and performance of the composite flexible packaging material The flexible packaging material containing SiOx vapor-deposited film usually consists of three layers: the SiOx film is sandwiched between two layers of plastic film to protect the SiOx film from damage. PET, LDPE, OPP, ON, etc. can be used as substrates for vapor-deposited SiOx films. And another plastic film compounded with it may be polypropylene, polystyrene, polyamide, etc. From the perspective of ease of recycling, the same resin can be used for the two-layer plastic film, such as OPP for the outer layer and CPP for the inner layer. 3. Application prospects Silicon vapor deposition composite flexible packaging materials are widely used. For example, it can be used to package dry food and high moisture food or liquid food. It can also be used in compound packaging materials for toothpaste, condiments, disposable packaging and various industrial products and chemical products. Gloabl Sports Equipments Co.,Ltd , https://www.sandingarchery.com
Compared with the composite material using PVDC as the barrier layer, the permeability of the silicon vapor deposited film composite material is less affected by temperature. For example, when the temperature rises from 20 ° C to 50 ° C, the oxygen permeability of PET / SiOx / CPP only increases from 0.21 to 0.5 cm3 / m² • 24h; under the same conditions, the oxygen permeability of PET / PVDC / CPP It is increased from 1.2 to 14.2 cubic centimeters per square meter • 24h.
Silicon vapor-deposited composite flexible packaging materials not only have excellent barrier properties, but also are transparent and heat-resistant, and can be suitable for microwave oven heating. These properties are not available in aluminum foil composite materials. Transparent flexible packaging will undoubtedly greatly promote sales.
The disadvantage of SiOx plating materials is that they cannot be heat-sealed. When the composite structure is not protected, the SiOx layer is brittle. Because it is very thin, it has good crack resistance and folding resistance after proper lamination.
New flexible packaging material-SIOx vapor deposited film